1. 2. 3. material content data sheet sales product name bfr 181w h6327 issued 29. august 2013 ma# MA000787820 package pg-sot323-3-1 weight* 5.95 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.002 0.03 303 non noble metal tin 7440-31-5 0.000 0.01 78 inorganic material silicon 7440-21-3 0.013 0.22 0.26 2245 2626 leadframe inorganic material silicon 7440-21-3 0.001 0.01 88 non noble metal titanium 7440-32-6 0.003 0.04 441 non noble metal chromium 7440-47-3 0.008 0.13 1324 non noble metal copper 7440-50-8 2.617 43.96 44.14 439516 441369 wire noble metal gold 7440-57-5 0.007 0.12 0.12 1217 1217 encapsulation organic material carbon black 1333-86-4 0.032 0.53 5308 plastics epoxy resin - 0.680 11.41 114126 inorganic material silicondioxide 60676-86-0 2.449 41.14 53.08 411385 530819 leadfinish non noble metal tin 7440-31-5 0.133 2.23 2.23 22287 22287 plating noble metal silver 7440-22-4 0.010 0.17 0.17 1682 1682 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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